DJI Mavic 3 Enterprise (3E, 3T and 3M): who makes it, what’s inside, and how it reads against the US lists.
Six applications across three filings: the 3E and 3T on 28 September 2022, the 3M on 23 November 2022, and Class II permissive changes on 15 September 2025 whose internal photos were held until 10 March 2026. The grantee, SZ DJI Technology, appears on the FCC Covered List and the 1260H list. The 2025 photos read DJI custom-marked processors, CXMT DRAM (CXMT is on the 1260H list), Skyworks front ends, Samsung eMMC, a GigaDevice part, an HDSC microcontroller, and Texas Instruments and Cypress parts.
- FCC ID
- SS3-M3E2206Grantee code SS3
- Grantee
- SZ DJI Technology Co., Ltd.The company the FCC granted the ID to
- Host maker on a list
- Listed: FCC Covered List, 1260H listFCC Covered List, Section 889, 1260H
- The read
- coveredHost, declared modules, and what the photos show
The record
The applications and their dates.
6 applications under this FCC ID
- Original grant: 2.4 GHz (models M3E and M3T)
- Original grant: 5.8 GHz (models M3E and M3T)
- Change adding model M3M: 2.4 GHz
- Change adding model M3M: 5.1 and 5.8 GHz
- Class II permissive change: 2.4 GHz, with new internal photos
- Class II permissive change: 5.1 GHz
Confidentiality
Every filing carries a confidentiality letter. The 2022 photos became public in March and May 2023; the 2025 photos on 10 March 2026, about six months after filing. The 2025 filings also carry attestation statements titled "Not Covered Entity Applicant Attestation" and "Not Covered Equipment Attestation", dated 15 September 2025; this read, dated 15 October 2026, finds the grantee on the Covered List as the list stood on that day.
Documents read
| Document read | Exhibit | Filed | Public | Pages |
|---|---|---|---|---|
| ID label and locationProduct Label and Location (2025) | 8669457 | 1 | ||
| Internal photosInternal Photos (2025, 2.4 GHz change) | 8669455 | (held 176 days) | 12 | |
| Internal photosInternal Photos (2025, 5.1 GHz change) | 8669484 | (held 176 days) | 12 | |
| Internal photosProduct Internal, M3M (2022) | 6238874 | (held 180 days) | 10 | |
| Operational descriptionAntenna Spec (2022) | 6238849 | 16 | ||
| Test reportTest Report, 2.4G SDR (2025) | 8669458 | 20 | ||
| Test reportFCC 5.8G SDR (2022) | 6238851 | 26 | ||
| Test reportFCC 5.1G SDR (2022) | 6238853 | 111 | ||
| User manualUser Manual (2025) | 8669461 | (held 176 days) | 25 |
The record is public. On the FCC’s own search (apps.fcc.gov, equipment authorisation) enter grantee code SS3 and product code -M3E2206 (the FCC keeps the dash as part of the product code); each exhibit above is listed there by the number in the Exhibit column.
What is inside
What the exhibits and the photos show.
A module is counted when an exhibit declares it or its own FCC ID is readable on a photo. A chip is counted when its marking can be read; a logo alone, or an illegible marking, is recorded as exactly that.
Modules the record declares
No module is declared in the record: no exhibit says "Contains FCC ID", and no module’s own FCC ID was read on the photos.
Chips read on the internal photos
| Part | Maker | Function | Read from |
|---|---|---|---|
| H6MN (custom marking)A DJI custom marking; no public datasheet names the chip maker | DJI | Main processor (SoC) | Internal photos, exhibit 8669455 |
| P1 (custom marking)A DJI custom marking | DJI | Processor | Internal photos, exhibit 8669455 |
| ACK2512, AJG2501 (custom markings)DJI custom markings | DJI | Unidentified | Internal photos, exhibit 8669455 |
| CXDB3ABAM, CXDB4CBAM | CXMT (ChangXin Memory Technologies) | DRAM | Internal photos, exhibit 8669455 |
| Not recorded | Skyworks | RF front-end modules | Internal photos, exhibit 8669455 |
| Not recorded | Samsung | eMMC flash | Internal photos, exhibit 8669455 |
| Not recorded | GigaDevice | Flash | Internal photos, exhibit 8669455 |
| HC32F176 | HDSC (Huada Semiconductor) | Microcontroller | Internal photos, exhibit 8669455 |
| Not recorded | Texas Instruments | Function not recorded | Internal photos, exhibit 8669455 |
| Not recorded | Cypress | Function not recorded | Internal photos, exhibit 8669455 |
Also in the record
Three models share this FCC ID. The 2025 photos show the 3T Advanced board; the 2022 photos the M3M.
Against the US lists
The host, the modules and the chips, against three lists.
| List | Host maker | Declared modules and chips read |
|---|---|---|
| FCC Covered List | Listed | None listed among what was read |
| Section 889 | Not listed | None listed among what was read |
| 1260H list | Listed | CXMT (ChangXin Memory Technologies) is listed: DRAM (CXDB3ABAM, CXDB4CBAM) |
The host maker is listed: SZ DJI Technology appears on the FCC Covered List and the 1260H list. A chip read in the photos is also made by a listed maker: CXMT DRAM, and CXMT appears on the 1260H list.
SZ DJI Technology was added to the FCC Covered List under section 1709 of the FY25 NDAA and appears on the 1260H list.
The record shows the host maker, or the maker of a declared module or a chip read in the photos, on one of the three lists.
Read 15 Oct 2026. FCC Covered List and Section 889 copies held by the desk on 15 Oct 2026; the desk’s copy of the 1260H list dated 10 Jun 2026.
What this read does not show
- DJI’s custom-marked processors have no public datasheet; the chip maker behind the marking cannot be read from the record.
- The GNSS board is shielded.
- Schematics, block diagrams and parts lists are held confidential and are not in the public list.
Signed by BSJ Ventures · read 15 Oct 2026
Not a legal opinion; a dated read of public records. It describes what the record shows and does not say what anyone may buy, sell, install or keep.
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